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PPC5604BAMLL4R Datasheet(PDF) 106 Page - NXP Semiconductors |
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PPC5604BAMLL4R Datasheet(HTML) 106 Page - NXP Semiconductors |
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106 / 109 page ![]() MPC5604B/C Microcontroller Data Sheet, Rev. 15 Document revision history NXP Semiconductors 106 10 15 Oct 2012 Table 2 (Bolero 512K device comparison), added footnote for MPC5603BxLH and MPC5604BxLH about FlexCAN availability. Table 2 (MPC5604B/C series block summary), replaced “System watchdog timer” with “Software watchdog timer” and specified AUTOSAR (Automotive Open System Architecture) Table 5 (Functional port pin descriptions): replaced footnote “Available only on MPC560xC versions and MPC5604B 208 MAPBGA devices” with “Available only on MPC560xC versions, MPC5603B 64 LQFP, MPC5604B 64 LQFP and MPC5604B 208 MAPBGA devices”, replaced VDD with VDD_HV Figure 10 (Voltage regulator capacitance connection), updated pin name appearance Renamed Figure 11 (VDD_HV and VDD_BV maximum slope) (was “VDD and VDD_BV maximum slope”) Renamed Figure 12 (VDD_HV and VDD_BV supply constraints during STANDBY mode exit) (was “VDD and VDD_BV supply constraints during STANDBY mode exit”) Table 12 (Recommended operating conditions (3.3 V)), added minimum value of TVDD and footnote about it. Table 13 (Recommended operating conditions (5.0 V)), added minimum value of TVDD and footnote about it. Section 2.17.1, “Voltage regulator electrical characteristics: replaced “slew rate of VDD/VDD_BV” with “slew rate of both VDD_HV and VDD_BV” replaced “When STANDBY mode is used, further constraints apply to the VDD/VDD_BV in order to guarantee correct regulator functionality during STANDBY exit.” with “When STANDBY mode is used, further constraints are applied to the both VDD_HV and VDD_BV in order to guarantee correct regulator function during STANDBY exit.” Table 27 (Power consumption on VDD_BV and VDD_HV), updated footnotes of IDDMAX and IDDRUN stating that both currents are drawn only from the VDD_BV pin. Table 31 (Flash memory power supply DC electrical characteristics), in the parameter column replaced VDD_BV and VDD_HV respectively with VDD_BV and VDD_HV. Table 45 (On-chip peripherals current consumption), in the parameter column replaced VDD_BV, VDD_HV and VDD_HV_ADC respectively with VDD_BV, VDD_HV and VDD_HV_ADC Updated Section 2.26.2, “Input impedance and ADC accuracy Table 46 (DSPI characteristics), modified symbol for tPCSC and tPASC 11 14 Nov 2012 In the cover feature list: added “and ECC” at the end of “Up to 512 KB on-chip code flash supported with the flash controller” added “with ECC” at the end of “Up to 48 KB on-chip SRAM” Table 12 (Recommended operating conditions (3.3 V)), removed minimum value of TVDD and relative footnote. Table 13 (Recommended operating conditions (5.0 V)), removed minimum value of TVDD and relative footnote. 12 19 Mar 2014 Added “K=TSMC Fab” against the Fab and mask indicator in Figure 45 (Commercial product code structure). Table 49. Revision history (continued) Revision Date Description of Changes |
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