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PPC5604BAMLL4R Datasheet(PDF) 106 Page - NXP Semiconductors

No. de pieza PPC5604BAMLL4R
Descripción Electrónicos  Single issue, 32-bit CPU core complex (e200z0)
PDF  109 Pages
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Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
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PPC5604BAMLL4R Datasheet(HTML) 106 Page - NXP Semiconductors

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MPC5604B/C Microcontroller Data Sheet, Rev. 15
Document revision history
NXP Semiconductors
106
10
15 Oct 2012
Table 2 (Bolero 512K device comparison), added footnote for MPC5603BxLH and
MPC5604BxLH about FlexCAN availability.
Table 2 (MPC5604B/C series block summary), replaced “System watchdog timer” with
“Software watchdog timer” and specified AUTOSAR (Automotive Open System
Architecture)
Table 5 (Functional port pin descriptions):
replaced footnote “Available only on MPC560xC versions and MPC5604B 208
MAPBGA devices” with “Available only on MPC560xC versions, MPC5603B 64 LQFP,
MPC5604B 64 LQFP and MPC5604B 208 MAPBGA devices”,
replaced VDD with VDD_HV
Figure 10 (Voltage regulator capacitance connection), updated pin name appearance
Renamed Figure 11 (VDD_HV and VDD_BV maximum slope) (was “VDD and VDD_BV
maximum slope”)
Renamed Figure 12 (VDD_HV and VDD_BV supply constraints during STANDBY mode exit)
(was “VDD and VDD_BV supply constraints during STANDBY mode exit”)
Table 12 (Recommended operating conditions (3.3 V)), added minimum value of TVDD
and footnote about it.
Table 13 (Recommended operating conditions (5.0 V)), added minimum value of TVDD
and footnote about it.
Section 2.17.1, “Voltage regulator electrical characteristics:
replaced “slew rate of VDD/VDD_BV” with “slew rate of both VDD_HV and VDD_BV
replaced “When STANDBY mode is used, further constraints apply to the VDD/VDD_BV
in order to guarantee correct regulator functionality during STANDBY exit.” with “When
STANDBY mode is used, further constraints are applied to the both VDD_HV and
VDD_BV in order to guarantee correct regulator function during STANDBY exit.”
Table 27 (Power consumption on VDD_BV and VDD_HV), updated footnotes of IDDMAX
and IDDRUN stating that both currents are drawn only from the VDD_BV pin.
Table 31 (Flash memory power supply DC electrical characteristics), in the parameter
column replaced VDD_BV and VDD_HV respectively with VDD_BV and VDD_HV.
Table 45 (On-chip peripherals current consumption), in the parameter column replaced
VDD_BV, VDD_HV and VDD_HV_ADC respectively with VDD_BV, VDD_HV and
VDD_HV_ADC
Updated Section 2.26.2, “Input impedance and ADC accuracy
Table 46 (DSPI characteristics), modified symbol for tPCSC and tPASC
11
14 Nov 2012 In the cover feature list:
added “and ECC” at the end of “Up to 512 KB on-chip code flash supported with the
flash controller”
added “with ECC” at the end of “Up to 48 KB on-chip SRAM”
Table 12 (Recommended operating conditions (3.3 V)), removed minimum value of TVDD
and relative footnote.
Table 13 (Recommended operating conditions (5.0 V)), removed minimum value of TVDD
and relative footnote.
12
19 Mar 2014 Added “K=TSMC Fab” against the Fab and mask indicator in Figure 45 (Commercial
product code structure).
Table 49. Revision history (continued)
Revision
Date
Description of Changes



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