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PPC5604BAMLL4R Datasheet(PDF) 42 Page - NXP Semiconductors

No. de pieza PPC5604BAMLL4R
Descripción Electrónicos  Single issue, 32-bit CPU core complex (e200z0)
PDF  109 Pages
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Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
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PPC5604BAMLL4R Datasheet(HTML) 42 Page - NXP Semiconductors

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MPC5604B/C Microcontroller Data Sheet, Rev. 15
Package pinouts and signal descriptions
NXP Semiconductors
42
2.15.4
Output pin transition times
2.15.5
I/O pad current specification
The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is associated to a
VDD/VSS supply pair as described in Table 21.
Table 20. Output pin transition times
Symbol C
Parameter
Conditions1
1 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified
Value
Unit
Min Typ Max
ttr CC D Output transition time output
pin2
SLOW configuration
2 C
L includes device and package capacitances (CPKG < 5 pF).
CL = 25 pF
VDD = 5.0 V ± 10%, PAD3V5V = 0
50
ns
TCL = 50 pF
100
DCL = 100 pF
125
DCL = 25 pF
VDD = 3.3 V ± 10%, PAD3V5V = 1
50
TCL = 50 pF
100
DCL = 100 pF
125
ttr CC D Output transition time output
pin2
MEDIUM configuration
CL = 25 pF
VDD = 5.0 V ± 10%, PAD3V5V = 0
SIUL.PCRx.SRC = 1
10
ns
TCL = 50 pF
20
DCL = 100 pF
40
DCL = 25 pF
VDD = 3.3 V ± 10%, PAD3V5V = 1
SIUL.PCRx.SRC = 1
——
12
TCL = 50 pF
25
DCL = 100 pF
40
ttr CC D Output transition time output
pin2
FAST configuration
CL = 25 pF
VDD = 5.0 V ± 10%, PAD3V5V = 0
4
ns
CL = 50 pF
6
CL = 100 pF
12
CL = 25 pF
VDD = 3.3 V ± 10%, PAD3V5V = 1
4
CL = 50 pF
7
CL = 100 pF
12
Table 21. I/O supply segment
Package
Supply segment
12
345
6
208 MAPBGA1
Equivalent to 144 LQFP segment pad distribution
MCKO
MDOn/MSEO
144 LQFP
pin20–pin49
pin51–pin99
pin100–pin122 pin 123–pin19
100 LQFP
pin16–pin35
pin37–pin69
pin70–pin83
pin 84–pin15
64 LQFP
pin8–pin26
pin28–pin55
pin56–pin7



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