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SSM3K56ACT Datasheet(PDF) 3 Page - Toshiba Semiconductor

No. de pieza SSM3K56ACT
Descripción Electrónicos  MOSFETs Silicon N-Channel MOS
PDF  8 Pages
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Fabricante Electrónico  TOSHIBA [Toshiba Semiconductor]
Página de inicio  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM3K56ACT Datasheet(HTML) 3 Page - Toshiba Semiconductor

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SSM3K56ACT
3
5.
5.
5.
5. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
5.1.
5.1.
5.1.
5.1. Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25
))))
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
Forward transfer admittance
(Note 1)
(Note 2)
(Note 3)
(Note 3)
Symbol
IGSS
IDSS
V(BR)DSS
V(BR)DSX
Vth
RDS(ON)
|Yfs|
Test Condition
VGS = ±6 V, VDS = 0 V
VDS = 10 V, VGS = 0 V
ID = 1 mA, VGS = 0 V
ID = 1 mA, VGS = -5 V
VDS = 3 V, ID = 1 mA
ID = 800 mA, VGS = 4.5 V
ID = 600 mA, VGS = 2.5 V
ID = 200 mA, VGS = 1.8 V
ID = 50 mA, VGS = 1.5 V
VDS = 3 V, ID = 200 mA
Min
20
15
0.4
Typ.
186
230
290
360
1.4
Max
±1
1
1.0
235
300
480
840
Unit
µA
V
mΩ
S
Note 1: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
Note 2: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (1 mA for
this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 3: Pulse measurement.
5.2.
5.2.
5.2.
5.2. Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25
))))
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (turn-on time)
Switching time (turn-off time)
Symbol
Ciss
Crss
Coss
ton
toff
Test Condition
VDS = 10 V, VGS = 0 V,
f = 1 MHz
VDD = 10 V, ID = 200 mA
VGS = 0 to 2.5 V, RG = 50 Ω,
Duty ≤ 1%, Input: tr, tf < 5 ns
Common source, See Chapter 5.3
Min
Typ.
55
6
16
5.5
8.5
Max
Unit
pF
ns
5.3.
5.3.
5.3.
5.3. Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.1
5.3.1
5.3.1
5.3.1 Test Circuit of Switching Time
Test Circuit of Switching Time
Test Circuit of Switching Time
Test Circuit of Switching Time
Fig.
Fig.
Fig.
Fig. 5.3.2
5.3.2
5.3.2
5.3.2 Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
5.4.
5.4.
5.4.
5.4. Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25
))))
Characteristics
Total gate charge (gate-source plus gate-drain)
Gate-source charge 1
Gate-drain charge
Symbol
Qg
Qgs1
Qgd
Test Condition
VDD = 10 V, VGS = 4.5 V,
ID = 800 mA
Min
Typ.
1.0
0.12
0.4
Max
Unit
nC
2015-11-16
Rev.1.0
©2015 Toshiba Corporation



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