ADF41513 datasheet(30/30 Pages) AD

30 / 30 page

ADF41513

Data Sheet

Rev. 0 | Page 30 of 30

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8

BOTTOM VIEW

TOP VIEW

SIDE VIEW

4.10

4.00 SQ

3.90

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

0.20 MIN

2.85

2.70 SQ

2.45

EXPOSED

PAD

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

SEATING

PLANE

PIN 1

INDICATOR

AREA

Figure 38. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-8)

Dimensions shown in millimeters

ORDERING GUIDE

Parameter1

Temperature Range

Package Description

Package Option

ADF41513BCPZ

−40°C to +105°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

ADF41513BCPZ-RL7

−40°C to +105°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

EV-ADF41513SD1Z

Evaluation Board Without VCO

EV-ADF41513SD2Z

Evaluation Board with On-Board VCO

Z = RoHS Compliant Part.

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D16805-0-1/19(0)

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