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GD25LQ64CSFS Datasheet(PDF) 75 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25LQ64CSFS Datasheet(HTML) 75 Page - GigaDevice Semiconductor (Beijing) Inc. |
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75 / 77 page ![]() 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ64C 75 11. REVISION HISTORY Version No Description Page Date 1.0 Initial Release Update AC CHARACTERISTICS: tSE typical 130ms change to 90ms Update DC CHARACTERISTICS: ICC1 typical 25ms change to 35ms Update DC CHARACTERISTICS: ICC1 max 40ms change to 50ms --- Mar. 5, 2014 1.1 Update DC CHARACTERISTICS: ICC3 condition 120MHz change to 133MHz --- Apr. 8,2014 1.2 Modify Quad SPI mode description Modify Data Protection description Modify BP4, BP3, BP2, BP1, BP0 description Add note on SRP1, SRP0 bits Modify Security Register Address Modify Command Description of 01H Add note on Read SFDP command --- Apr. 28,2014 1.3 Update DC CHARACTERISTICS: ICC4, ICC5, ICC6, ICC7 max 10mA change to max 20mA Update DC CHARACTERISTICS: ICC3 Test Condition Q=Open(*1 I/O) change to Q=Open(*1,*2,*4 I/O) --- Jul. 11, 2014 1.4 Modify Package WSON 8 (6*5mm) --- Jun. 11, 2015 1.5 Modify Package VSOP8 208MIL --- July.15,2015 1.6 Add Package USON8 (4*4mm, 0.45 thickness) --- Oct. 8,2015 1.7 Modify AC CHARACTERISTICS: tCHCL Min.0.2 V/ns Change to 0.1 V/ns tCLCH Min.0.2 V/ns Change to 0.1 V/ns --- Nov. 11,2015 1.8 Modify Typo --- Jan. 4,2016 1.9 Modify DC CHARACTERISTICS Modify PACKAGE INFORMATION --- Feb. 24,2016 2.0 Modify General Description Delete Data Retention and endurance Delete Latch up characteristics Modify Absolute maximum Ratings: Delete Output Short Circuit Current 200mA --- Feb. 26,2016 2.1 Modify Ordering information --- Jun. 2,2016 2.2 Modify Features: Add Allows XIP(execute in place)operation --- Jul. 6,2016 2.3 Update Package WSON8 6*5mm Update Ordering information Modify Ordering information: Add Valid Part Numbers Add Transient Input/Output Volatge (note:overshoot):-2.0 to (VCC+2.0)V Modify VCC:-0.6 to (VCC+0.4)V Change to -0.6 to 2.5V --- Jul. 27,2016 |
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