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MPC866PZP100 Datasheet(PDF) 88 Page - Freescale Semiconductor, Inc |
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MPC866PZP100 Datasheet(HTML) 88 Page - Freescale Semiconductor, Inc |
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88 / 92 page  88 MPC866/859 Hardware Specifications MOTOROLA Document Revision History Document Revision History 16 Document Revision History Table 40 lists significant changes between revisions of this document. Table 40. Document Revision History Revision Number Date Substantive Changes 0 5/2002 Initial revision 1 11/2002 Added the 5-V tolerant pins, new package dimensions, and other changes. 1.1 4/2003 Added the Spec. B1d and changed spec. B1a. Added the Note Solder sphere composition for MPC866XZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb 2%Ag to Figure 15-79. 1.2 4/2003 Added the MPC859P. 1.3 5/2003 Changed the SPI Master Timing Specs. 162 and 164. 1.4 7-8/2003 • Added TxClav and RxClav to PB15 and PC15. Changed B28a through B28d and B29b to show that TRLX can be 0 or 1. • Added nontechnical reformatting. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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