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MPC866PZP100 Datasheet(PDF) 87 Page - Freescale Semiconductor, Inc |
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MPC866PZP100 Datasheet(HTML) 87 Page - Freescale Semiconductor, Inc |
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87 / 92 page ![]() MOTOROLA MPC866/859 Hardware Specifications 87 Mechanical Data and Ordering Information Figure 79. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition for MPC866XZP, MPC859PZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb 2%Ag Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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