Substrate Bending test

・Test substrate

Material

: Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness : 1.6mm

Copper foil thickness : 0.035mm

　　　　　　　　　　　: Solder resist (Coat with heat resistant resin for solder)

Fig.1

(in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

Fig.2

(in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady) , Durability

・Test substrate

Material

: Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

Fig.3

＊2

4.0±0.1

0.05以下

＊1

-0

Ａ

t

*1,2：2.0±0.05

100

a

b

Land

f4.5

b

a

Solder Resist

Chip Capacitor

Land

45

45

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

45

45

R5

20

50 min.

Type

Dimension (mm)

a

b

c

GQM18

1.0

3.0

1.2

GQM21

1.2

4.0

1.65

Type

Dimension (mm)

a

b

c

GQM18

1.0

3.0

1.2

GQM21

1.2

4.0

1.65

JEMCNS-0022E

4