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ST-0503 Datasheet(PDF) 2 Page - Soberton Inc. |
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ST-0503 Datasheet(HTML) 2 Page - Soberton Inc. |
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2 / 5 page ![]() MODEL: ST-0503 PRODUCT: Electromagnetic Buzzer EDITION: A/2017 RELIABILITY TEST item test conditions evaluation standard operating life test ORDINARY TEMPERATURE The part will be subjected to 96 hours of continuous operation at +25±10oC After the test the part will meet specifications without any degradation in appearance and performance except SPL, after 4 hours at +25oC. The SPL would be in ±10dBA compared with initial one. HIGH TEMPERATURE The part will be subjected to 72 hours of continuous operation at +70oC with 3.0V, 4000Hz applied. LOW TEMPERATURE The part will be subjected to 72 hours of continuous operation at -30oC with 3.0V, 4000Hz applied. TEST CONDITION Standard Test Condition : a)Temperature: +5~+35oC b)Humidity:45~85% c)Pressure: 860~1060mbar MECHANICAL CHARACTERISTICS item test condition evaluation standard solderability Lead terminals are immersed in solder bath of +250±5oC for 3±1 seconds. 90% min. lead terminals will be wet with solder No interference in operation. soldering heat resistance The product followed the reflow profile to test its reflow thermo-stability. terminal mechanical strength Lead pads will be soldered on the pc board, and the force 9.8N(1.0Kg) will be applied behind the part for 10 seconds. No damage and cutting off vibration The part will be subjected to a vibration cycle of 10Hz to 55Hz to 10Hz in a period of 1 minute. Total peak amplitude will be 1.52mm(9.3G). The vibration test will consist of 2 hours per axis in each three axes (X,Y,Z). Total 6 hours. After the test the part will meet specifications without any damage in appearance and per- formance except SPL. SPL would be in ±10dBA compared with initial one. drop test The part only will be dropped from a height of 75cm onto a 40mm thick wooden board 3 times in 3 axes (X,Y,Z). Total of 9 times. RECOMMENDED TEMPERATURE PROFILE FOR REFLOW OVEN PAGE 2/5 Recommendable wave soldering condition is as follows: Note 1: It is requested that reflow soldering should be executed after heat of product goes down to normal temperature. Note 2: Peak reflow temperature of 250˚C maximum of 10 seconds, with a maximum duration of 40-60 seconds between 220˚C and 250˚C |
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