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ICH-500 Datasheet(PDF) 2 Page - Murata Power Solutions Inc. |
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ICH-500 Datasheet(HTML) 2 Page - Murata Power Solutions Inc. |
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2 / 17 page ![]() www.murata-ps.com/support MDC_ICH_500W_A04 Page 2 of 17 ICH 500-Watt Series Wide Input Isolated Half Brick DC-DC Electrical Specifications – All Models Conditions: Ta = 25ºC, airflow = 300 LFM (1.5m/s), Vin = 24VDC, unless otherwise specified. Specifications subject to change without notice. Parameter Notes Min Typ Max Units Absolute Maximum Ratings Input Voltage Continuous 0 40 V Transient (100ms) 50 V Operating Temperature (See Note 1) Baseplate (100% load) Standard model -40 105 ºC Storage Temperature -55 125 ºC Isolation Characteristics and Safety Isolation Voltage Input to Output 2250 V Input to Baseplate & Output to Baseplate 1500 V Isolation Capacitance 4500 pF Isolation Resistance 10 20 M Insulation Safety Rating Basic Agency Approvals Designed to meet UL/cUL 60950, IEC/EN 60950-1 Feature Characteristics Fixed Switching Frequency Output Voltage Ripple has twice this frequency 200 kHz Output Voltage Trim Range ± 10 % Remote Sense Compensation This function is not provided N/A % Output Overvoltage Protection Non-latching 117 124 130 % Overtemperature Shutdown (Baseplate) Non-latching 110 120 ºC Auto-Restart Period Applies to all protection features 450 500 550 ms Turn-On Time from Vin Time from UVLO to Vo=90% Vout (NOM) Resistive load 517 530 ms Turn-On time from ON/OFF Control Trim from ON to Vo=90% Vout (NOM) Resistive load 17 20 ms Rise Time Vout from 10% to 90% 4 7.5 11 ms ON/OFF Control - Positive Logic ON state Pin open = ON or external voltage applied 2 12 V Control Current Leakage current 0.16 mA OFF state 0 0.8 V Control Current Sinking 0.3 0.36 mA ON/OFF Control - Negative Logic ON state Pin shorted to -INPUT or 0.8 V OFF state Pin open = Off or 2 12 V Thermal Characteristics Thermal resistance Baseplate to Ambient Converter soldered to 3.95” x 2.5” x 0.07” 4 layer/ 2oz copper FR4 PCB. 5.2 ºC/W 1. A thermal management device, such as a heatsink, is required to ensure proper operation of this device. The thermal management medium is required to maintain baseplate < 105ºC for full rated power. |
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