FN8276 Rev 0.00

Page 19 of 21

November 27, 2013

HIP2103, HIP2104

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• Large power components (Power FETs, Electrolytic caps, power

resistors, etc.) have internal parasitic inductance which cannot

be eliminated. This must be accounted for in the PCB layout

and circuit design.

• If you simulate your circuits, consider including parasitic

components especially parasitic inductance.

General EPAD Heatsinking

Considerations

The EPAD of the HIP2103, HIP2104 is electrically connected to

VSS through the IC substrate. The epad has two main functions:

to provide a quiet signal ground and to provide heat sinking for

the IC. The EPAD must be connected to a ground plane and

switching currents from the driven FETs should not pass through

the ground plane under the IC.

Figure 28 is a PCB layout example of how to use vias to remove

heat from the IC through the EPAD.

For maximum heatsinking, it is recommended that a ground

plane, connected to the EPAD, be added to both sides of the PCB.

A via array, within the area of the EPAD, will conduct heat from

the EPAD to the GND plane on the bottom layer. The number of

vias and the size of the GND planes required for adequate

heatsinking is determined by the power dissipated by the

HIP2103, HIP2104, the air flow, and the maximum temperature

of the air around the IC.

Note that a separate plane is added under the high side drive

circuits and is connected to HS. In a manner similar to the ground

plane, the HS plane provides the lowest possible parasitic

inductance for the HO/HS gate drive current loop.

See AN1899 “HIP2103, HIP2104 3-phase, Full, or Half Bridge

Motor Driver” for an example of PCB layout of a real application.

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VDD

EPAD GND

PLANE

COMPONENT

LAYER

HI

LI

LS

HB

HO

HS

LO

EPAD GND

PLANE

BOTTOM

LAYER

VDD

HI

LI

LS

HB

HO

HS

LO

This plane is

connected to

HS and is under

all high side

driver circuits

FIGURE 28. TYPICAL PCB PATTERN FOR THERMAL VIAS

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that

you have the latest revision.

DATE

REVISION

CHANGE

November 27, 2013

FN8276.0

Initial Release