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MPXM2102AS Datasheet(PDF) 331 Page - Motorola, Inc

No. de pieza MPXM2102AS
Descripción Electrónicos  Sensor
PDF  670 Pages
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Fabricante Electrónico  MOTOROLA [Motorola, Inc]
Página de inicio  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPXM2102AS Datasheet(HTML) 331 Page - Motorola, Inc

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MPXV6115VC6U
3–185
Motorola Sensor Device Data
www.motorola.com/semiconductors
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
VS Pin 2
+5.0 V
GND Pin 3
Vout Pin 4
MPXV6115VC6U
to ADC
100 nF
51 K
47 pF
FLUOROSILICONE
GEL DIE COAT
WIRE BOND
DIFFERENTIAL SENSING
ELEMENT
THERMOPLASTIC
CASE
STAINLESS
STEEL CAP
LEAD
FRAME
P1
P2
DIE BOND
DIE
Figure 2 illustrates the absolute sensing chip in the basic
Small Outline chip carrier (Case 482).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4. Output versus Absolute Pressure
MAX
TRANSFER FUNCTION:
Vout = VS*[(0.007652*P) + 0.92] ± (Pressure error
*Temp Factor*0.007652*VS)
VS = 5.0 V ± 0.25 Vdc
TEMP = 0–85
° C
MIN
–115
–95
–75
–55
–35
–15
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Vout vs. VACUUM
TRANSFER FUNCTION MPXV6115VC6U
0
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85
°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
MPXV6115VC6U pressure sensor operating characteristics,
internal reliability and qualification tests are based on use of
dry air as the pressure media. Media other than dry air may
have adverse effects on sensor performance and long–term
reliability. Contact the factory for information regarding me-
dia compatibility in your application.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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