MPXM2102AS datasheet(333/670 Pages) MOTOROLA

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MPXM2102AS Datasheet(PDF) 333 Page - Motorola, Inc

333 / 670 page

MPXV6115VC6U

3–187

Motorola Sensor Device Data

www.motorola.com/semiconductors

SURFACE MOUNTING INFORMATION

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self–align when subjected to

a solder reflow process. It is always recommended to fabri-

cate boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP

2.54

0.300

7.62

Figure 5. SOP Footprint (Case 482A)

inch

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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