MPXM2102AS datasheet(327/670 Pages) MOTOROLA

327 / 670 page

MPXV5004G SERIES

3–181

Motorola Sensor Device Data

www.motorola.com/semiconductors

ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

The performance over temperature is achieved by inte-

grating the shear–stress strain gauge, temperature com-

pensation, calibration and signal conditioning circuitry onto a

single monolithic chip.

Figure 2 illustrates the gauge configuration in the basic chip

carrier (Case 482). A fluorosilicone gel isolates the die surface

and wire bonds from the environment, while allowing the pres-

sure signal to be transmitted to the silicon diaphragm.

The MPXV5004G series sensor operating characteristics

are based on use of dry air as pressure media. Media, other

than dry air, may have adverse effects on sensor performance

and long–term reliability. Internal reliability and qualification

test for dry air, and other media, are available from the factory.

Contact the factory for information regarding media tolerance

in your application.

Figure 3 shows the recommended decoupling circuit for in-

terfacing the output of the MPXV5004G to the A/D input of

the microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum and maximum output curves

are shown for operation over a temperature range of 10

°C to

°C using the decoupling circuit shown in Figure 3. The

output will saturate outside of the specified pressure range.

Figure 2. Cross–Sectional Diagram (Not to Scale)

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

Figure 3. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

FLUOROSILICONE

GEL DIE COAT

WIRE BOND

DIFFERENTIAL SENSING

ELEMENT

THERMOPLASTIC

CASE

STAINLESS

STEEL CAP

LEAD

FRAME

DIE BOND

DIE

Figure 4. Output versus Pressure Differential

MAX

DIFFERENTIAL PRESSURE

5.0

4.0

3.0

2.0

TRANSFER FUNCTION:

Vout = VS*[(0.2*P) + 0.2] ± 1.5% VFSS

VS = 5.0 V ± 0.25 Vdc

TEMP = 10 to 60

°C

1.0

MIN

TYPICAL

2 kPa

200 mm H2O

(See Note 5 in Operating Characteristics)

4 kPa

400 mm H2O

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

MPXM2102AS Datasheet(PDF) 327 Page - Motorola, Inc

MPXM2102AS Datasheet(HTML) 327 Page - Motorola, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Descarga

Enlace URL