STM8SPLNB1 datasheet(36/44 Pages) STMICROELECTRONICS

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STM8SPLNB1

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DocID018831 Rev 5

5.3

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 22: General operating conditions.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x JA)

Where:



TAmax is the maximum ambient temperature in C



JA is the package junction-to-ambient thermal resistance in C/W



PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)



PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.



PI/Omax represents the maximum power dissipation on output pins

Where:

PI/Omax = (VOL*IOL) + ((VDD-VOH)*IOH),

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in

the application.

5.3.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

Table 34. Thermal characteristics(1)

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit

Thermal resistance junction-ambient

TSSOP20 - 4.4 mm

°C/W

Thermal resistance junction-ambient

SO20W - (300 mils)

Thermal resistance junction-ambient

UFQFPN20 - 3 x 3 mm

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