ST72361AR4-Auto datasheet(259/279 Pages) STMICROELECTRONICS

259 / 279 page

ST72361xx-Auto

Package characteristics

Doc ID 12468 Rev 3

259/279

20.3

Thermal characteristics

20.4

Packaging for automatic handling

The devices can be supplied in trays or with tape and reel conditioning.

Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when

facing the tape sprocket holes as shown in Figure 127.

Figure 127. pin 1 orientation in tape and reel conditioning

See also Figure 128: ST72F361xx-Auto Flash commercial product structure on page 264

and Figure 129: ST72P361xxx-Auto FastROM commercial product structure on page 265.

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to

ambient)

LQFP64

LQFP44

LQFP32

°C/W

Power dissipation(1)

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation

of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip

internal power (IDD xVDD) and PPORT is the port power dissipation depending on the ports used in the

application.

500

TJmax

Maximum junction temperature(2)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

Right orientation (EIA 481-C compliant)

Left orientation

Pin 1

ST72361AR4-Auto Datasheet(PDF) 259 Page - STMicroelectronics