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TNETV1644ZDU6 Datasheet(PDF) 159 Page - Texas Instruments

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No. de pieza TNETV1644ZDU6
Descripción Electrónicos  Digital Media Processor
PDF  306 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TNETV1644ZDU6 Datasheet(HTML) 159 Page - Texas Instruments

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5.2 Recommended Operating Conditions
(1)
TMS320DM6437
Digital Media Processor
www.ti.com
SPRS345D – NOVEMBER 2006 – REVISED JUNE 2008
MIN
NOM
MAX
UNIT
(-7/-6/-5/-4/-L/-Q6/-Q5/-Q4
1.14
1.2
1.26
V
Supply voltage, Core (CVDD,
devices)
CVDD
VDDA_1P1V)
(2)
(-7/-6/-5/-4/-L/-Q5 devices)
1.0
1.05
1.1
V
Supply voltage, I/O, 3.3V (DVDD33)
2.97
3.3
3.63
V
DVDD
Supply voltage, I/O, 1.8V (DVDDR2, DDR_VDDDLL, PLLPWR18, VDDA_1P8V,
1.71
1.8
1.89
V
MXVDD
(3))
VSS
Supply ground (VSS, VSSA_1P8V, VSSA_1P1V, DDR_VSSDLL, MXVSS
(4))
0
0
0
V
DDR_VREF
DDR2 reference voltage(5)
0.49DVDDR2
0.5DVDDR2
0.51DVDDR2
V
DDR_ZP
DDR2 impedance control, connected via 200
Ω resistor to V
SS
VSS
V
DDR_ZN
DDR2 impedance control, connected via 200
Ω resistor to DV
DDR2
DVDDR2
V
DAC_VREF
DAC reference voltage input
0.475
0.5
0.525
V
DAC_RBIAS
DAC biasing, connected via 4 k
Ω resistor to V
SSA_1P8V
VSSA_1P8V
V
High-level input voltage, 3.3V (except PCI-capable and I2C pins)
2
V
High-level input voltage, MXI/ CLKIN
0.65MXVDD
V
VIH
High-level input voltage, PCI
0.5DVDD33
DVDD33 + 0.5
V
High-level input voltage, I2C
0.7DVDD33
V
Low-level input voltage, 3.3V (except PCI-capable and I2C pins)
0.8
V
Low-level input voltage, MXI/ CLKIN
0.35MXVDD
V
VIL
Low-level input voltage, PCI
–0.5
0.3DVDD33
V
Low-level input voltage, I2C
0
0.3DVDD33
V
Commercial
0
90
°C
TJ
Operating Junction temperature(6)(7)
Automotive (Q or S suffix)
–40
125
°C
Commercial
0
70
°C
TA
Operating Ambient temperature(7)
Automotive (Q or S suffix)
-40
85
°C
-7 devices
700
MHz
-Q6 devices
660
MHz
DSP Operating Frequency
(SYSCLK1),
-6/ -L devices
600
MHz
CVDD = 1.2 V
-5/-Q5 devices
500
MHz
FSYSCLK1
(2)
-4/-Q4 devices
400
MHz
-7 devices
560
MHz
DSP Operating Frequency
-6/-L devices
450
MHz
(SYSCLK1),
-5/-Q5 devices
400
MHz
CVDD = 1.05 V
-4 devices
350
MHz
(1)
The actual voltage must be determined at device power-up, and not be changed dynamically during run-time.
(2)
Applies to "tape and reel" part number counterparts as well. For more information, see Section 2.8, Device and Development-Support
Tool Nomenclature.
(3)
Oscillator 1.8 V power supply (MXVDD) can be connected to the same 1.8 V power supply as DVDDR2.
(4)
Oscillator ground (MXVSS) must be kept separate from other grounds and connected directly to the crystal load capacitor ground.
(5)
DDR_VREF is expected to equal 0.5DVDDR2 of the transmitting device and to track variations in the DVDDR2.
(6)
In the absence of a heat sink or direct thermal attachment on the top of the device, use the following formula to determine the device
junction temperature: TJ = TC + (Power x PsiJT). Power and TC can be measured by the user. Section 7.1, Thermal Data for ZWT and
Section 7.1.1, Thermal Data for ZDU provide the junction-to-package top (PSIJT) value based on airflow in the system. In the presence
of a heat sink or direct thermal attachment on the top of the device, additional calculations and considerations must be taken into
account. For more detailed information on thermal considerations, measurements, and calculations, see the Thermal Considerations for
TMS320DM64xx, TMS320DM64x, and TMS320C6000 Devices Application Report (literature number SPRAAL9).
(7)
Applications must meet both the Operating Junction Temperature and Operating Ambient Temperature requirements. For more detailed
information on thermal considerations, measurements, and calculations, see the Thermal Considerations for TMS320DM64xx,
TMS320DM64x, and TMS320C6000 Devices Application Report (literature number SPRAAL9).
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Device Operating Conditions
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