DocID8564 Rev 4

5/8

STPS15L45C

Package Information

8

2

Package Information



Epoxy meets UL94,V0



Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

2.1

DPAK package information

Figure 9. DPAK package outline

Note:

This package drawing may slightly differ from the physical package. However, all the

specified dimensions are guaranteed.