Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Spanish  ▼
ALLDATASHEET.ES

X  

AD5675 Datasheet(PDF) 27 Page - Analog Devices

No. de pieza AD5675
Descripción Electrónicos  Base station power amplifiers
PDF  27 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD5675 Datasheet(HTML) 27 Page - Analog Devices

Back Button AD5675 Datasheet HTML 19Page - Analog Devices AD5675 Datasheet HTML 20Page - Analog Devices AD5675 Datasheet HTML 21Page - Analog Devices AD5675 Datasheet HTML 22Page - Analog Devices AD5675 Datasheet HTML 23Page - Analog Devices AD5675 Datasheet HTML 24Page - Analog Devices AD5675 Datasheet HTML 25Page - Analog Devices AD5675 Datasheet HTML 26Page - Analog Devices AD5675 Datasheet HTML 27Page - Analog Devices  
Zoom Inzoom in Zoom Outzoom out
 27 / 27 page
background image
AD5675
Data Sheet
Rev. B | Page 26 of 26
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
Figure 51. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.18
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGD.
BOTTOM VIEW
TOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.75
2.60 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
Figure 52. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-20-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Resolution
(Bits)
Temperature
Range
Accuracy
Package Description
Package
Option
AD5675ARUZ
16
−40°C to +125°C
±8 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5675ARUZ-REEL7
16
−40°C to +125°C
±8 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5675BRUZ
16
−40°C to +125°C
±3 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5675BRUZ-REEL7
16
−40°C to +125°C
±3 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5675ACPZ-REEL7
16
−40°C to +125°C
±8 LSB INL
20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-8
AD5675BCPZ-REEL7
16
−40°C to +125°C
±3 LSB INL
20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-8
EVAL-AD5675SDZ
Evaluation Board
1 Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2015–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12550-0-8/16(B)



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27


Datasheet Descarga

Go To PDF Page


Enlace URL



¿ALLDATASHEET es útil para Ud.?  [ DONATE ] 

Todo acerca de Alldatasheet   |   Publicidad   |   Contáctenos   |   Política de Privacidad   |   Enlace a la hoja de datos    |   Intercambio de Enlaces   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com