MB95F613K datasheet(107/110 Pages) CYPRESS

107 / 110 page

Document Number: 002-04698 Rev. *A

Page 107 of 110

PRELIMINARY

MB95610H Series

21. Package Dimension

80-pin plastic LQFP

Lead pitch

0.50 mm

Package width

package length

12.00 mm

× 12.00 mm

Lead shape

Gullwing

Lead bend

direction

Normal bend

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.47 g

80-pin plastic LQFP

(FPT-80P-M37)

2009-2010 FUJITSU SEMICONDUCTOR LIMITED F80037S-c-1-2

120

INDEX

*12.00±0.10(.472±.004)SQ

14.00±0.20(.551±.008)SQ

0.50(.020)

0.22±0.05

(.009±.002)

0.08(.003)

0.145±0.055

(.006±.002)

0.08(.003)

"A"

(Stand off)

Details of "A" part

(.004±.002)

0.10±0.05

(.024±.006)

0.60±0.15

(.020±.008)

0.25(.010)

0.50±0.20

(Mounting height)

.059 –.004

+.008

–

0.10

+0.20

1.50

0~8°

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

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