Thermal Characteristic

Thermal Resistance,Junction-to-Case

(Note 2)

1.36

/W

℃

Parameter

Symbol

Condition

Min

Typ

Max

Unit

Off Characteristics

Drain-Source Breakdown Voltage

60

68

-

V

Zero Gate Voltage Drain Current

-

-

1

μA

Gate-Body Leakage Current

-

-

±100

nA

On Characteristics

(Note 3)

Gate Threshold Voltage

2

3

4

V

Drain-Source On-State Resistance

-

9.1

11.5

m

Ω

Forward Transconductance

20

-

-

S

Dynamic Characteristics

(Note4)

Input Capacitance

-

2350

-

PF

Output Capacitance

-

237

-

PF

Reverse Transfer Capacitance

F=1.0MHz

-

205

-

PF

Switching Characteristics

(Note 4)

Turn-on Delay Time

-

16

-

nS

Turn-on Rise Time

-

10

-

nS

Turn-Off Delay Time

-

45

-

nS

Turn-Off Fall Time

-

12

-

nS

Total Gate Charge

-

50

-

nC

Gate-Source Charge

-

12

-

nC

Gate-Drain Charge

-

16

-

nC

Drain-Source Diode Characteristics

Diode Forward Voltage

(Note 3)

-

-

1.2

V

Diode Forward Current

(Note 2)

-

-

75

A

Reverse Recovery Time

-

28

nS

Reverse Recovery Charge

Qrr

TJ = 25°C, IF =75A

di/dt = 100A/

μs

(Note3)

-

49

nC

Forward Turn-On Time

Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

Notes:

1. Repetitive Rating: Pulse width limited by maximum junction temperature.

2. Surface Mounted on FR4 Board, t

≤ 10 sec.

3. Pulse Test: Pulse Width

≤ 300μs, Duty Cycle ≤ 2%.

4. Guaranteed by design, not subject to production

MORE Semiconductor Company Limited

http://www.moresemi.com

2/6

MSN0675K