STM32F756VG datasheet(205/228 Pages) STMICROELECTRONICS

No. de pieza	STM32F756VG

Descripción Electrónicos	Up to 25 communication interfaces

PDF	228 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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DocID027589 Rev 4

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STM32F756xx

Package information

227

Marking of engineering samples

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

Figure 87. WLCSP143, 0.4 mm pitch wafer level chip scale package

top view example

1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet

qualified and therefore not yet ready to be used in production and any consequences deriving from such

usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering

samples in production. ST Quality has to be contacted prior to any decision to use these Engineering

samples to run qualification activity.

Table 116. WLCSP143 recommended PCB design rules

Dimension

Recommended values

Pitch

0.4

Dpad

0.225 mm

Dsm

0.290 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.250 mm

Stencil thickness

0.100 mm

STM32F756VG Datasheet(PDF) 205 Page - STMicroelectronics