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STM32F756VG Datasheet(PDF) 201 Page - STMicroelectronics |
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STM32F756VG Datasheet(HTML) 201 Page - STMicroelectronics |
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201 / 228 page ![]() DocID027589 Rev 4 201/228 STM32F756xx Package information 227 Figure 83. TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array package recommended footprint 1. Dimensions are expressed in millimeters. D 7.850 8.000 8.150 0.3091 0.3150 0.3209 D1 - 7.200 - 0.2835 - E 7.850 8.000 8.150 0.3091 0.3150 0.3209 E1 - 7.200 - - 0.2835 - e - 0.800 - - 0.0315 - F - 0.400 - - 0.0157 - G - 0.400 - - 0.0157 - ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 113. TFBGA100, 8 x 8 × 0.8 mm thin fine-pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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