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STM32F756VG Datasheet(PDF) 207 Page - STMicroelectronics |
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STM32F756VG Datasheet(HTML) 207 Page - STMicroelectronics |
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207 / 228 page ![]() DocID027589 Rev 4 207/228 STM32F756xx Package information 227 Figure 89. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package recommended footprint 1. Dimensions are expressed in millimeters. D1 19.800 20.000 20.200 0.7795 0.7874 0.7953 D3 - 17.500 - - 0.689 - E 21.800 22.000 22.200 0.8583 0.8661 0.8740 E1 19.800 20.000 20.200 0.7795 0.7874 0.7953 E3 - 17.500 - - 0.6890 - e - 0.500 - - 0.0197 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0°3.5°7° 0° 3.5° 7° ccc - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 117. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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