RPC564L60L5BFSR datasheet(89/137 Pages) STMICROELECTRONICS

89 / 137 page

DocID026934 Rev 1

89/137

RPC56EL60L5

Electrical characteristics

136

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998,

pp. 47–54.

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled

Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal

Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San

Diego, 1999, pp. 212–220.

3.5

Electromagnetic Interference (EMI) characteristics

The characteristics in Table 13 were measured using:



Device configuration, tet conditions, and EM testing per standard IEC61967-2



Supply voltage of 3.3 V DC



Ambient temperature of 25

C

The configuration information referenced in Table 13 is explained in Table 12.

Table 12. EMI configuration summary

Configuration name

Description

Configuration A

• High emission = all pads have max slew rate, LVDS pads running at 40 MHz

• Oscillator frequency = 40 MHz

• System bus frequency = 80 MHz

• No PLL frequency modulation

• IEC level I (

 36 dBV)

Configuration B

• Reference emission = pads use min, mid and max slew rates, LVDS pads disabled

• Oscillator frequency = 40 MHz

• System bus frequency = 80 MHz

• 2% PLL frequency modulation

• IEC level K(

 30 dBV)

RPC564L60L5BFSR Datasheet(PDF) 89 Page - STMicroelectronics