LM20133MHXSLASHNOPB datasheet(3/29 Pages) TI

3 / 29 page

LM20133, LM20133Q

www.ti.com

SNVS526F – OCTOBER 2007 – REVISED MARCH 2013

ABSOLUTE MAXIMUM RATINGS

(1)

Voltages from the indicated pins to GND

AVIN, PVIN, EN, PGOOD, SS/TRK, COMP, FB, SW, SYNC

-0.3V to +6V

Storage Temperature

-65°C to 150°C

Junction Temperature

150°C

Power Dissipation(2)

2.6W

Lead Temperature (Soldering, 10 sec)

260°C

Minimum ESD Rating

±2kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not specific performance limits. For specifications and test conditions, see the

Electrical Characteristics.

(2)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ_MAX, the junctions-to-ambient thermal

resistance,

θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using: PD_MAX = (TJ_MAX – TA)/θJA. The maximum power dissipations of 2.6W is determined using TA = 25°C, θJA = 38°C/W, and TJ_MAX

= 125°C.

OPERATING RATINGS

PVIN, AVIN to GND

2.95V to 5.5V

Junction Temperature

−40°C to + 125°C

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LM20133MHX/NOPB Datasheet(PDF) 3 Page - Texas Instruments