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LTC2400CS8 Datasheet(PDF) 21 Page - Linear Technology |
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LTC2400CS8 Datasheet(HTML) 21 Page - Linear Technology |
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21 / 40 page ![]() 21 LTC2400 pin on each falling edge of SCK. The internally generated serial clock is output to the SCK pin. This signal may be used to shift the conversion result into external circuitry. After the 32nd rising edge, CS is pulled HIGH and a new conversion is immediately started. This is useful in appli- cations requiring periodic monitoring and ultralow power. Figure 14 shows the average supply current as a function of capacitance on CS. It should be noticed that the external capacitor discharge current is kept very small in order to decrease the con- verter power dissipation in the sleep state. In the autostart mode the analog voltage on the CS pin cannot be observed without disturbing the converter operation using a regular oscilloscope probe. When using this configuration, it is important to minimize the external leakage current at the CS pin by using a low leakage external capacitor and properly cleaning the PCB surface. The internal serial clock mode is selected every time the voltage on the CS pin crosses an internal threshold volt- age. An internal weak pull-up at the SCK pin is active while CS is discharging; therefore, the internal serial clock timing mode is automatically selected if SCK is floating. It is important to ensure there are no external drivers pulling SCK LOW while CS is discharging. DIGITAL SIGNAL LEVELS The LTC2400’s digital interface is easy to use. Its digital inputs (FO, CS and SCK in External SCK mode of operation) accept standard TTL/CMOS logic levels and the internal hysteresis receivers can tolerate edge rates as slow as 100 µs.However,someconsiderationsarerequiredtotake advantage of exceptional accuracy and low supply current. The digital output signals (SDO and SCK in Internal SCK mode of operation) are less of a concern because they are not generally active during the conversion state. In order to preserve the LTC2400’s accuracy, it is very important to minimize the ground path impedance which may appear in series with the input and/or reference signal and to reduce the current which may flow through this path. The GND pin should be connected to a low resistance ground plane through a minimum length trace. The use of multiple via holes is recommended to further reduce the APPLICATIONS INFORMATION CAPACITANCE ON CS (pF) 1 5 6 7 1000 10000 2400 F12 4 3 10 100 100000 2 1 0 VCC = 5V VCC = 3V Figure 12. CS Capacitance vs tSAMPLE CAPACITANCE ON CS (pF) 0 3 4 5 1000 100000 2400 F13 2 1 0 10 100 10000 6 7 8 VCC = 5V VCC = 3V Figure 13. CS Capacitance vs Output Rate CAPACITANCE ON CS (pF) 1 0 50 100 150 200 250 300 10 100 1000 10000 2400 F14 100000 VCC = 5V VCC = 3V Figure 14. CS Capacitance vs Supply Current |
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