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AN3317 Datasheet(PDF) 16 Page - STMicroelectronics

No. de pieza AN3317
Descripción Electrónicos  PCB guidelines for SPEAr1340
PDF  22 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
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AN3317 Datasheet(HTML) 16 Page - STMicroelectronics

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USB routing
AN3317
16/22
Doc ID 18249 Rev 2
6
USB routing
Ensure that USB signal trace routing follows good high speed PCB rules, and meets the
specifications for differential impedance and maximum trace delay between the connector
and the SPEAr device.
Route USB data traces with the shortest, most direct path possible to their connectors.
USB data traces should have no resistors.
Route USB data traces only over ground planes.
Never route USB data traces across gaps or breaks in the return plane.
Never route USB data traces under other devices or between the pins of other devices.
Widely separate USB data vias from other signal vias.
If USB data traces must transition layers to a different return plane, place ground vias for the
return current very close to the signal vias.
Figure 4.
PCB cross section showing minimum spacing dimensions
Table 2.
USB signal routing constraints
Parameter
Description
Minimum
Typical
Maximum
Units
Zodiff
Differential Impedance(1)
1.
Trace delay between SPEAr device and USB connector (Universal Serial Bus Specification, Revision 2.0)
81
90
99
Ω
Td Dev
Trace delay of device port(1)
1.0
ns
Td Host
Trace delay of host port(1)
3.0
ns
Td-match
Trace length mismatch
0.15
3.8
inch
mm
Number or length of stubs
0
Number of via transitions
1
Space to adjacent signal traces(2)
2.
Includes other USB data trace pairs.
3h(3)
3.
The same as the units used for h, the thickness of the dielectric separating the trace from the nearest
plane (see Figure 4), which can vary from board-to-board.
Space to adjacent area fill(4)
4.
Do not use guard traces or ground flood or fill adjacent to high speed signal traces.
3h(3)
Space to edge of return plane
20
h(3)



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