AX2000 datasheet(259/262 Pages) MICROSEMI

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Axcelerator Family FPGAs

Re vi s i on 18

4-5

Revision 8

(continued)

The following changes were made in the "FG676"(AX500) section:

AE2, AE25

Change from NC to GND.

AF2, AF25

Changed from GND to NC

AB4, AF24, C1, C26

Changed from VCCDA to VCCA

AD15

Change from VCCDA to VCOMPLE

AD17

Changed from VCOMPLE to VCCDA

3-37

In the "FG896" (AX2000) section, the AK28 changed from VCCIB5 to VCCIB4.

3-52

The "CQ352" and "CG624" sections are new.

3-98, 3-115

Revision 7

(Advance v1.6)

All I/O FIFO capability was removed.

n/a

Table 1 was updated.

Figure 1-9 was updated.

1-7

Figure 2-5 was updated.

2-16

The "Using an I/O Register" section was updated.

2-16

The AX250 and AX1000 descriptions were added to the "FG484"section.

3-21

Revision 6

(Advance v1.5)

Table 2-3 was updated.

2-2

Figure 2-1 was updated.

2-8

Figure 2-48 was updated.

2-75

Figure 2-52 was updated.

2-82

Revision 5

(Advance v1.4)

In the "PQ208" table, pin 196 was missing, but it has been added in this version

with a function of GND.

3-84

The following pins in the "FG484" table for AX500 were changed:

Pin G7 is GND/LP

Pins AB8, C10, C11, C14, AB16 are NC.

3-21

The "FG676" table was updated.

3-37

Revision 4

(Advance v1.3)

The "Device Resources" section was updated for the CS180.

The "Programmable Interconnect Element" and Figure 1-2 are new.

1-1 and 1-2

The "CS180" table is new.

3-1

The "PQ208" tables for the AX500 were updated. The following pins were not

defined in the previous version:

GND 21

IO106PB5F10/CLKHP 71

GND 136

3-84

Revision 3

(Advance v1.2)

Table 1, "Ordering Information", "Device Resources", and the Product Plan table

were updated.

i, ii

The following figures and tables were updated:

Figure 1-3

Figure 1-8 (new)

Table 2-3

Figure 2-2

Table 2-8

Figure 2-11

1-2

1-6

2-2

2-9

2-12

2-23

The "Design Environment" section was updated.

1-7

The "Package Thermal Characteristics" was updated.

2-6

Revision

Changes

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