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BCP53 Datasheet(PDF) 18 Page - NXP Semiconductors |
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BCP53 Datasheet(HTML) 18 Page - NXP Semiconductors |
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18 / 22 page ![]() BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 9 — 19 October 2011 18 of 22 NXP Semiconductors BCP53; BCX53; BC53PA 80 V, 1 A PNP medium power transistors Reflow soldering is the only recommended soldering method. Fig 26. Reflow soldering footprint SOT1061 (HUSON3) occupied area solder paste = solder lands Dimensions in mm sot1061_fr solder resist 0.4 2.1 1.3 0.25 0.25 0.25 1.1 1.2 0.55 0.6 2.3 0.5 (2 ×) 0.5 (2 ×) 0.6 (2×) 0.4 (2 ×) 0.5 1.6 1.7 1.05 |
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