DCPL-WB-00C2 datasheet(1/11 Pages) STMICROELECTRONICS

No. de pieza	DCPL-WB-00C2

Descripción Electrónicos	Wide-band, dual-path directional coupler with ISO port

PDF	11 Pages

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Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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1 / 11 page

October 2010

Doc ID 17994 Rev 1

1/11

11

DCPL-WB-00C2

Wide-band, dual-path directional coupler with ISO port

Features

■ 50

Ω nominal input / output impedance

■ wide operating frequency range:

– 824 MHz-2170 MHz

■ low insertion loss (< 0.2 dB)

■ 37 dB typical coupling factor

■ high directivity (> 20 dB)

■ high ESD ruggedness

■ lead-free CSP package

■ Flip-Chip package

■ small footprint: 1700 x 1850 µm

■ very low profile (< 670 µm thickness)

Benefits

■ high RF performance

■ RF module size reduction

Complies with the following standards:

■ IEC 61000-4-2 level 4:

– 15 kV (air discharge)

– 8 kV (contact discharge)

Applications

Multi-band equipment such as:

■ power amplifier module

■ front end module

■ GSM/WCDMA mobile phone

Figure 1.

Pin configuration (bump view)

Description

The DCPL-WB-00C2 is a wide-band, dual-path

directional coupler designed to measure cell

phone transmission output power in

GSM/WCDMA applications. This dual-path CPL

has been customized for wide-band operating

frequencies (EGSM and CELL, PCS, DCS,

WCDMA band I) with less than 0.2 dB insertion

losses in the transmission bandwidth (824 MHz -

1980 MHz).

This device is built with two different RF couplers

(one dedicated to LB, the other dedicated to HB)

sharing the same coupled and isolated ports.The

DCPL-WB-00C2 has been designed using

STMicroelectronics IPD (integrated passive

device) technology on non-conductive glass

substrate to optimize RF performance.

The device is delivered 100% tested in tape and

reel.

Lead-free Flip Chip (8 bumps)

LB Path

HB Path

A1

A2

A3

C1

C2

C3

B1

B3

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DCPL-WB-00C2 Datasheet(PDF) 1 Page - STMicroelectronics

DCPL-WB-00C2 Datasheet(HTML) 1 Page - STMicroelectronics

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