Package information

DCPL-WB-00C2

8/11

Doc ID 17994 Rev 1

3

Package information

●

Epoxy meets UL94, V0

●

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 11.

Package dimensions

Figure 12.

Footprint

Figure 13.

Marking

A1

A2

A3

B1

C1

C2

C3

B3

A1

A1

A2

A2

A3

A3

B1

B1

C1

C1

C2

C2

C3

C3

B3

B3

670 µm

315 µm dia.

1.7 mm

600µm

600µm

Copper pad diameter :

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

x

y

x

w

z

w

Dot, ST logo

ECOPACK status

xx = marking

z = manufacturing

location

yww = datecode

(y = year ww = week)