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AS3421 Datasheet(PDF) 6 Page - ams AG |
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AS3421 Datasheet(HTML) 6 Page - ams AG |
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6 / 61 page ![]() www.austriamicrosystems.com Revision 0.90 6 - 61 AS3421 AS3422 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 6 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device should be operated under recommended operating conditions. Table 2. Absolute Maximum Ratings Parameter Min Max Units Comments Reference Ground Defined as in GND Supply terminals -0.5 2.0 V Applicable for pin VBAT, HPVDD Ground terminals -0.5 0.5 V Applicable for pins AGND Negative terminals -2.0 0.5 V Applicable for pins VNEG, VSS, HPVSS Voltage difference at VSS terminals -0.5 0.5 V Applicable for pins VSS, HPVSS Pins with protection to VBAT VNEG -0.5 5.0 VBAT+0.5 V Applicable for pins CPP, CPN Pins with protection to HPVDD VSS -0.5 5.0 HPVDD+0.5 V Applicable for pins LINL_P/N, LINR_P/N, MICL/ R, HPR, HPL, QMICL/R, QLINL/R, IOPx, QOPx other pins VSS -0.5 5 Applicable for pins MICS, ANC_CSDA, MODE_CSCL Input Current (latch-up immunity) -100 100 mA Norm: JEDEC 17 Continuous Power Dissipation (TA = +70ºC) Continuous Power Dissipation - 200 mW PT 1 for QFN16/24/32 package 1. Depending on actual PCB layout and PCB used Electrostatic Discharge Electrostatic Discharge HBM +/-2 kV Norm: JEDEC JESD22-A114C Temperature Ranges and Storage Conditions Junction Temperature +110 ºC Storage Temperature Range -55 +125 ºC Humidity non-condensing 5 85 % Moisture Sensitive Level 3 Represents a max. floor life time of 168h Package Body Temperature 260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/ JEDEC J-STD-020“Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. |
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