APTS050A0X datasheet(18/20 Pages) LINEAGEPOWER

18 / 20 page

Preliminary Data Sheet

February 14, 2011

GigaTLynxTM SMT Non-isolated Power Modules:

4.5 – 14Vdc input; 0.7Vdc to 2.0Vdc, 50A Output

LINEAGE POWER

Surface Mount Information

Pick and Place

The Giga TLynx

TM SMT modules use an open frame

construction and are designed for a fully automated

assembly process. The modules are fitted with a

label designed to provide a large surface area for pick

and place operations. The label meets all the

requirements for surface mount processing, as well as

safety standards, and is able to withstand reflow

temperatures of up to 300

oC. The label also carries

product information such as product code, serial

number and location of manufacture.

Figure 31. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by

using open frame construction. Even so, these

modules have a relatively large mass when compared

to conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and pick &

placement speed should be considered to optimize

this process. The minimum recommended inside

nozzle diameter for reliable operation is 3mm. The

maximum nozzle outer diameter, which will safely fit

within the allowable component spacing, is 5 mm

max.

Bottom Side Assembly

This module is not recommended for assembly

on the bottom side of a customer board. If such

an assembly is attempted, components may fall

off the module during the second reflow process.

If assembly on the bottom side is planned, please

contact Lineage Power for special manufacturing

process instructions.

Lead-free (Pb-free) Soldering

The –Z version Giga TLynx modules

are lead-free

(Pb-free) and RoHS compliant and are both

forward and backward compatible in a Pb-free and

a SnPb soldering process

. Failure to observe the

instructions below may result in the failure of or

cause damage to the modules and can

adversely affect long-term reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C

(Moisture/Reflow

Sensitivity

Classification

for

Nonhermetic Solid State Surface Mount Devices)

for both Pb-free solder profiles

and

MSL

classification procedures. This standard provides

recommended

forced-air-convection

reflow

profile based on the volume and thickness of the

package (table 4-2). The suggested Pb-free solder

paste is Sn/Ag/Cu (SAC).

Recommended linear reflow profile using Sn/Ag/Cu

solder:

NOTE: Soldering outside of the recommended

profile requires testing to verify results and

performance.

Tin Lead Soldering

The Giga TLynx

TM SMT power modules are lead free

modules and can be soldered either in a lead-free

solder process or in a conventional Tin/Lead (Sn/Pb)

process. It is recommended that the customer review

data sheets in order to customize the solder reflow

profile for each application board assembly. The

following instructions must be observed when

soldering these units. Failure to observe these

instructions may result in the failure of or cause

Per J-STD-020 Rev. C

100

150

200

250

300

Reflow Time (Seconds)

Heating Zone

1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C

15 Seconds

*Time Above 217°C

60 Seconds

Cooling Zone

4°C/Second

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