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MIC4451 Datasheet(PDF) 9 Page - Micrel Semiconductor |
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MIC4451 Datasheet(HTML) 9 Page - Micrel Semiconductor |
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9 / 14 page ![]() Micrel Inc. MIC4451/4452 January 2011 9 M9999-011811 Input Stage The input voltage level of the MIC4451 changes the quiescent supply current. The N channel MOSFET input stage transistor drives a 320µA current source load. With a logic “1” input, the maximum quiescent supply current is 400µA. Logic “0” input level signals reduce quiescent current to 80µA typical. The MIC4451/4452 input is designed to provide 200mV of hysteresis. This provides clean transitions, reduces noise sensitivity, and minimizes output stage current spiking when changing states. Input voltage threshold level is approximately 1.5V, making the device TTL compatible over the full temperature and operating supply voltage ranges. Input current is less than ±10µA. The MIC4451 can be directly driven by the TL494, SG1526/1527, SG1524, TSC170, MIC38C42, and similar switch mode power supply integrated circuits. By offloading the power-driving duties to the MIC4451/4452, the power supply controller can operate at lower dissipation. This can improve performance and reliability. The input can be greater than the VS supply, however, current will flow into the input lead. The input currents can be as high as 30mA p-p (6.4mARMS) with the input. No damage will occur to MIC4451/4452 however, and it will not latch. The input appears as a 7pF capacitance and does not change even if the input is driven from an AC source. While the device will operate and no damage will occur up to 25V below the negative rail, input current will increase up to 1mA/V due to the clamping action of the input, ESD diode, and 1kΩ resistor. Power Dissipation CMOS circuits usually permit the user to ignore power dissipation. Logic families such as 4000 and 74C have outputs which can only supply a few milliamperes of current, and even shorting outputs to ground will not force enough current to destroy the device. The MIC4451/4452 on the other hand, can source or sink several amperes and drive large capacitive loads at high frequency. The package power dissipation limit can easily be exceeded. Therefore, some attention should be given to power dissipation when driving low impedance loads and/or operating at high frequency. MIC4451 1 8 6, 7 5 4 +18 0.1µF 0.1µF TEK CURRENT PROBE 6302 2,500 pF POLYCARBONATE 5.0V 0 V 18 V 0 V 300 mV 12 AMPS PC TRACE RESISTANCE = 0.05Ω LOGIC GROUND POWER GROUND WIMA MKS-2 1µF Figure 5. Switching Time Degradation Due to Negative Feedback The supply current vs. frequency and supply current vs capacitive load characteristic curves aid in determining power dissipation calculations. Table 1 lists the maximum safe operating frequency for several power supply voltages when driving a 10,000pF load. More accurate power dissipation figures can be obtained by summing the three dissipation sources. Given the power dissipation in the device, and the thermal resistance of the package, junction operating temperature for any ambient is easy to calculate. For example, the thermal resistance of the 8-pin plastic DIP package, from the data sheet, is 130°C/W. In a 25°C ambient, then, using a maximum junction temperature of 125°C, this package will dissipate 960mW. Accurate power dissipation numbers can be obtained by summing the three sources of power dissipation in the device: • Load Power Dissipation (PL) • Quiescent power dissipation (PQ) • Transition power dissipation (PT) Calculation of load power dissipation differs depending on whether the load is capacitive, resistive or inductive. |
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