AD8222BCPZ-R7 datasheet(6/24 Pages) AD

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AD8222

Rev. A | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

±18 V

Output Short-Circuit Current Duration

Indefinite

Input Voltage (Common Mode)

±VS

Differential Input Voltage

±VS

Storage Temperature Range

−65°C to +130°C

Operational Temperature Range

−40°C to +125°C

Package Glass Transition Temperature (TG)

130°C

ESD

Human Body Model

1 kV

Charge Device Model

1 kV

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions may affect device reliability.

THERMAL RESISTANCE

Table 6.

Package

θJA

Unit

CP-16-19: LFCSP Without Thermal Pad

°C/W

CP-16-13: LFCSP with Thermal Pad

°C/W

The θJA values in Table 6 assume a 4-layer JEDEC standard

board. For the LFCSP with thermal pad, it is assumed that the

thermal pad is soldered to a landing on the PCB board, with the

landing thermally connected to a heat dissipating power plane.

θJC at the exposed pad is 4.4°C/W.

Maximum Power Dissipation

The maximum safe power dissipation for the AD8222 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 130C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 130°C for an

extended period can result in a loss of functionality.

ESD CAUTION

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