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STCD1020PDH6F Datasheet(PDF) 15 Page - STMicroelectronics

No. de pieza STCD1020PDH6F
Descripción Electrónicos  Multichannel clock distribution circuit
PDF  40 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STCD1020PDH6F Datasheet(HTML) 15 Page - STMicroelectronics

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STCD1020, STCD1030, STCD1040
Maximum ratings
Doc ID 13823 Rev 6
15/40
5
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 4.
Absolute maximum ratings (1.8 V supply)
Symbol
Parameter
Value
Unit
TSTG
Storage temperature (VCC off)
–55 to 150
°C
TSLD
(1)
1.
Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Lead solder temperature for 10 seconds
260
°C
TJ
Maximum junction temperature
150
°C
VCC
Supply voltage
–0.3 to 3.6
V
VIN
Input voltage level
–0.3 to 3.6
V
VEN
Voltage on enable pins
–0.3 to 3.6
V
θ
JA
Thermal resistance (junction to ambient)
TDFN8
149.0
°C/W
TDFN10
136.6
°C/W
TDFN12
132.4
°C/W
Table 5.
Absolute maximum ratings (2.8 V supply)
Symbol
Parameter
Value
Unit
TSTG
Storage temperature (VCC off)
–55 to 150
°C
TSLD
(1)
1.
Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Lead solder temperature for 10 seconds
260
°C
TJ
Maximum junction temperature
150
°C
VCC
Supply voltage
–0.3 to 6
V
VIN
Input voltage level
–0.3 to 6
V
VEN
Voltage on enable pins
–0.3 to 6
V
θ
JA
Thermal resistance (junction to ambient)
TDFN8
149.0
°C/W
TDFN10
136.6
°C/W
TDFN12
132.4
°C/W



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