MPC8533ECHXAAJB datasheet(94/116 Pages) FREESCALE

94 / 116 page

MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

Thermal

Table 66 provides the thermal resistance with heat sink in open flow.

Simulations with heat sinks were done with the package mounted on the 2s2p thermal test board. The

thermal interface material was a typical thermal grease such as Dow Corning 340 or Wakefield 120 grease.

For system thermal modeling, the MPC8533E thermal model without a lid is shown in Figure 56. The

substrate is modeled as a block 29

× 29 × 1.18 mm with an in-plane conductivity of 18.0 W/m•K and a

through-plane conductivity of 1.0 W/m•K. The solder balls and air are modeled as a single block

× 29 × 0.58 mm with an in-plane conductivity of 0.034 W/m•K and a through plane conductivity of

12.1 W/m•K. The die is modeled as 7.6

× 8.4 mm with a thickness of 0.75 mm. The bump/underfill layer

is modeled as a collapsed thermal resistance between the die and substrate assuming a conductivity of

6.5 W/m•K in the thickness dimension of 0.07 mm. The die is centered on the substrate. The thermal model

uses approximate dimensions to reduce grid. Please refer to Figure 55 for actual dimensions.

20.2

Recommended Thermal Model

Table 67 shows the MPC8533E thermal model.

Table 66. Thermal Resistance with Heat Sink in Open Flow

Heat Sink with Thermal Grease

Air Flow

Thermal Resistance (

°C/W)

Wakefield 53

× 53 × 25 mm pin fin

Natural convection

6.1

Wakefield 53

× 53 × 25 mm pin fin

1 m/s

3.0

Aavid 35

× 31 × 23 mm pin fin

Natural convection

8.1

Aavid 35

× 31 × 23 mm pin fin

1 m/s

4.3

Aavid 30

× 30 × 9.4 mm pin fin

Natural convection

11.6

Aavid 30

× 30 × 9.4 mm pin fin

1 m/s

6.7

Aavid 43

× 41 × 16.5 mm pin fin

Natural convection

8.3

Aavid 43

× 41 × 16.5 mm pin fin

1 m/s

4.3

Table 67. MPC8533EThermal Model

Conductivity

Value

Units

Die (7.6

× 8.4 × 0.75mm)

Silicon

Temperature dependent

—

Bump/Underfill (7.6

× 8.4 × 0.070 mm) Collapsed Thermal Resistance

6.5

W/m•K

Substrate (29

× 29 × 1.18 mm)

W/m•K

1.0

MPC8533ECHXAAJB Datasheet(PDF) 94 Page - Freescale Semiconductor, Inc

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