Analog Integrated Circuit Device Data

Freescale Semiconductor

5

33730

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

Supply Voltage (VBAT)

-0.3 to +40

V

Keep-Alive Supply Voltage (KA_VBAT)

-18 to +40

V

-18 to +40

V

Bootstrap Voltage (BOOT, SR) referenced to ground

-0.3 to +50

V

Bootstrap Voltage (BOOT, SR) referenced to SW

-0.3 to +12

V

Charge Pump Output Voltage (CP)

-0.3 to +12

V

Switch Node Voltage SW

-2.0 to +40

V

Sensor Supplies (VREF1, VREF2)

-1.0 to +26.5

V

-0.3 to +7.0

V

Open Drain Outputs (RSTH, RSTL, RST3, RSTKAM, IGN_ON), REGON

-0.3 to +7.0

V

Analog Inputs (VCOMP, INV, FREQ, HRT)

-0.3 to +3.0

V

ESD Voltage(1)

Human Body Model - HBM (all pins except BOOT, VDDL, RSTL)

Human Body Model - HBM (Pins BOOT, VDDL, RSTL)

Machine Model - MM (all pins)

Charge Device Model - CDM (all pins)

±2000

±1500

±200

±750

V

Operational Package Temperature (Ambient Temperature)

-40 to +125

°C

Storage Temperature

-65 to +150

°C

Peak Package Reflow Temperature During Reflow(2), (3)

Note 3

°C

Maximum Junction Temperature

150

°C

Thermal Resistance, Junction to Ambient(4)

41

°C/W

Thermal Resistance, Junction to Case(5)

1.2

°C/W

Notes

1.

ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), the Machine Model (MM) (AEC-Q100-003),

2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

4.

Thermal resistance measured in accordance with EIA/JESD51-2.

5.

Theoretical thermal resistance from the die junction to the exposed pad.