SE97TP datasheet(45/54 Pages) NXP

No. de pieza	SE97TP

Descripción Electrónicos	DDR memory module temp sensor with integrated SPD, 3.3 V

PDF	54 Pages

Scroll/Zoom	100%

Fabricante Electrónico	NXP [NXP Semiconductors]

Página de inicio	http://www.nxp.com

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45 / 54 page

SE97_5

Product data sheet

Rev. 05 — 6 August 2009

45 of 54

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Fig 41. Package outline SOT908-1 (HVSON8)

0.5

0.2

0.05

0.00

UNIT

D(1)

1.5

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

3.1

2.9

cDh

1.65

1.35

3.1

2.9

2.25

1.95

0.3

0.2

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT908-1

MO-229

E(1)

0.5

0.3

0.1

0.05

SOT908-1

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

A(1)

max.

05-09-26

05-10-05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

terminal 1

index area

detail X

exposed tie bar (4

×)

exposed tie bar (4

×)

terminal 1

index area

v M

w M

2 mm

scale

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