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BUF16821 Datasheet(PDF) 2 Page - EPCOS |
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BUF16821 Datasheet(HTML) 2 Page - EPCOS |
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2 / 29 page ![]() ABSOLUTE MAXIMUM RATINGS (1) BUF16821 SBOS428 – JULY 2008 ...................................................................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE PACKAGE DESIGNATOR PACKAGE MARKING BUF16821 HTSSOP-28 PWP BUF16821 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Over operating free-air temperature range (unless otherwise noted). PARAMETER BUF16821 UNIT Supply Voltage VS +22 V Supply Voltage VSD +6 V Digital Input Pins, SCL, SDA, AO, BKSEL: Voltage –0.5 to +6 V Digital Input Pins, SCL, SDA, AO, BKSEL: Current ±10 mA Output Pins, OUT1 through OUT16, VCOM1 and VCOM2 (2) (V–) – 0.5 to (V+) + 0.5 V Output Short-Circuit(3) Continuous Ambient Operating Temperature –40 to +95 °C Ambient Storage Temperature –65 to +150 °C Junction Temperature TJ +125 °C Human Body Model (HBM) 3000 V ESD Rating Charged Device Model (CDM) 1000 V Machine Model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) See the Output Protection section. (3) Short-circuit to ground, one amplifier per package. 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): BUF16821 |
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