STTS424E02BDA3F datasheet(49/51 Pages) STMICROELECTRONICS

No. de pieza	STTS424E02BDA3F

Descripción Electrónicos	Memory module temperature sensor with a 2 Kb SPD EEPROM

PDF	51 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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STTS424E02

Landing pattern

49/51

Table 31 lists variations of landing pattern implementations, ranked as “Preferred” and

Minimum Acceptable” based on the JEDEC proposal.

Table 31.

Parameters for landing pattern - TDFN package (DN)

Parameter

Description

Dimension

Min

Nom

Max

Heat paddle width

1.40

1.60

Heat paddle height

1.40

1.60

Heat paddle centerline to contact inner locus

1.00

Contact length

0.70

0.80

Heat paddle to contact keepout

0.20

Contact to contact keepout

0.20

Contact centerline to contact centerline pitch for inner contacts

0.50

Contact width for inner contacts

0.25

0.30

Landing pattern centerline to outer contact centerline, “minimum

acceptable” option(1)

-0.50-

Corner contact width, “minimum acceptable option”(1)

0.25

0.30

Landing pattern centerline to outer contact centerline, “preferred”

option(2)

-0.60-

Corner contact width, “preferred” option(2)

0.45

0.50

Minimum acceptable option to be used when routing prevents preferred width contact.

Preferred option to be used when possible.

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