ADXL346

Data Sheet

LAYOUT AND DESIGN RECOMMENDATIONS

Figure 62 shows the recommended printed wiring board land pattern. Figure 63 and Table 27 provide details about the recommended

soldering profile.

3.3500

0.8000

0.3000

0.5000

3.3500

Figure 62. Recommended Printed Wiring Board Land Pattern

(Dimensions shown in millimeters)

tP

tL

t25°C TO PEAK

tS

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

TP

TL

Figure 63. Recommended Soldering Profile

Table 27. Recommended Soldering Profile1, 2

Condition

Profile Feature

Sn63/Pb37

Pb-Free

Average Ramp Rate from Liquid Temperature (TL) to Peak Temperature (TP)

3°C/sec max

3°C/sec max

Preheat

Minimum Temperature (TSMIN)

100°C

150°C

Maximum Temperature (TSMAX)

150°C

200°C

Time from TSMIN to TSMAX (tS)

60 sec to 120 sec

60 sec to 180 sec

TSMAX to TL Ramp-Up Rate

3°C/sec max

3°C/sec max

Liquid Temperature (TL)

183°C

217°C

Time Maintained Above TL (tL)

60 sec to 150 sec

60 sec to 150 sec

Peak Temperature (TP)

240 + 0/−5°C

260 + 0/−5°C

Time of Actual TP − 5°C (tP)

10 sec to 30 sec

20 sec to 40 sec

Ramp-Down Rate

6°C/sec max

6°C/sec max

Time 25°C to Peak Temperature

6 minutes max

8 minutes max

1

Based on JEDEC Standard J-STD-020D.1.

2

For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.

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