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TAS2781RYYR Datasheet(PDF) 88 Page - Texas Instruments |
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TAS2781RYYR Datasheet(HTML) 88 Page - Texas Instruments |
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88 / 90 page ![]() www.ti.com EXAMPLE BOARD LAYOUT (R0.05) TYP 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND 19X (0.6) 26X (0.2) (3.3) (3.8) (1.12) 22X (0.4) 8X (0.425) 8X (0.25) 2X (1) (0.925) 2X (1) (0.7) (0.65) 4X (R0.12) (0.95) 2X (0.7) 2X (0.62) 2X (0.78) 2X (0.6) VQFN-HR - 1 mm max height RYY0030A PLASTIC QUAD FLATPACK - NO LEAD 4228222/B 05/2022 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. PKG PKG SEE SOLDER MASK DETAIL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X 1 9 10 16 17 23 24 30 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS |
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