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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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L6711 Datasheet(PDF) 11 Page - STMicroelectronics |
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L6711 Datasheet(HTML) 11 Page - STMicroelectronics |
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11 / 50 page  L6711 Pins description and connection diagrams 11/50 45 BOOT1 Channel 1 HS driver supply. This pin supplies the relative high side driver. Connect through a capacitor (100nF Typ.) to the PHASE1 pin and through a diode to VCC (cathode vs. boot). 46 UGATE1 Channel 1 HS driver output. A little series resistor helps in reducing device-dissipated power. 47 PHASE1 Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides the return path for the HS driver of channel 1. 48 N.C. Not internally connected. PAD THERMAL PAD Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to dissipate the power necessary to drive the external mosfets. Connect to the GND plane with several vias to improve thermal conductivity. Table 1. Pins description (continued) N° Name Description |
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