WILCS02IC datasheet(20/71 Pages) MICROCHIP

20 / 71 page

WILCS02IC and WILCS02 Family

Device Overview

Data Sheet

DS70005557C - 20

Figure 2-12. Example of Host Board on Top Layer

Host Board Outline

Module Outline

Copper Keepout

Module Footprint

Exposed GND Pad

Underneath Module

GND Plane on Host Board

2.6

WILCS02 Module RF Considerations

The overall performance of the system is significantly affected by the product design, environment

and application. The product designer must ensure system-level shielding (if required) and verify the

performance of the product features and applications.

Consider the following guidelines for optimal RF performance:

• The WILCS02 Module must be positioned in a noise-free RF environment and must be kept far

away from high-frequency clock signals and any other sources of RF energy.

• The antenna must not be shielded by any metal objects.

• The power supply must be clean and noise-free.

• Make sure that the width of the traces routed to GND, VDD rails are sufficiently large for handling

peak TX current consumption.

Note: The WILCS02 Module includes RF shielding on top of the board as a standard feature.

2.7

WILCS02 Module Antenna Considerations

2.7.1

PCB Antenna

For the WILCS02PE Module, the PCB antenna is fabricated on the top copper layer. The layers below

the antenna do not have a copper trace. It is recommended that the module be mounted on the

edge of the host board and to have no PCB material below the antenna structure of the module and

no copper traces or planes on the host board in that area.

The following table lists the technical specification of the PCB antenna when tested with the

WILCS02 Module mounted on the WILCS02 Wi-Fi® Link Controller SD Board.

WILCS02IC Datasheet(PDF) 20 Page - Microchip Technology