WILCS02IC datasheet(19/71 Pages) MICROCHIP

No. de pieza	WILCS02IC

Descripción Electrónicos	single chip 2.4 GHz and IEEE 802.11b/g/n-compliant solution

PDF	71 Pages

Scroll/Zoom	100%

Fabricante Electrónico	MICROCHIP [Microchip Technology]

Página de inicio	http://www.microchip.com

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19 / 71 page

WILCS02IC and WILCS02 Family

Device Overview

Data Sheet

DS70005557C - 19

Figure 2-11. WILCS02 Module Placement

Related Links

WILCS02 Module Packaging Information

2.5

WILCS02 Module Routing Guidelines

• Use the multi-layer host board for routing signals on the inner layer and the bottom layer.

• The top layer (underneath the module) of the host board must be ground with as many GND vias

as possible, as illustrated in the following figure.

• Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the

edge of the WILCS02 Module.

• For a better GND connection to the WILCS02 Module, solder the exposed GND pads of the

WILCS02 Module on the host board.

• For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to

all the layers and thermal conduction path.

• Having a series resistor on the host board for all reserved pins and digital interface pins is

recommended. These resistors must be placed close to the WILCS02 Module.

WILCS02IC Datasheet(PDF) 19 Page - Microchip Technology