6.5 Electrical Characteristics: LM50 (LM50B and LM50C)

LM50: +VS = 5V (DC) and ILOAD = 0.5µA, TA = TJ = 25°C (unless otherwise noted)(1)

LM50B (Legacy chip only): TA = TMIN to TMAX = -25°C to 100°C

LM50B (New chip) and LM50C (Both New and Legacy chip): TA = TMIN to TMAX = -40°C to 125°C

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SENSOR ACCURACY

TACY

Temperature accuracy(2)

TA = 25°C

LM50B

(Legacy chip)

-2

2

°C

TA = TMAX = 100°C

-3

3

TA = TMIN = -25°C

-3.5

3

TA = 25°C

LM50B

(New chip)

-2

2

°C

TA = TMAX = 125°C

-3

3

TA = TMIN = -40°C

-3.5

3

TA = 25°C

LM50C

-3

3

°C

TA = TMAX = 125°C

-4

4

TA = TMIN = -40°C

-4

4

SENSOR OUTPUT

V0°C

Output voltage offset at 0°C

500

mV

TC

Temperature coefficient

(sensor gain)

TA = TJ = TMIN to TMAX

9.7

10

10.3

mV/°C

VONL

Output Nonlinearity(3)

TA = TJ = TMIN to TMAX

LM50

-0.8

0.8

°C

ZOUT

Output impedance

TA = TJ = TMIN to TMAX

2000

4000

Ω

TON

Turn-On Time

LM50 (Legacy chip)

5

µs

LM50 (New chip)

30

TLTD

Long-term stability and drift(4) TJ = 125°C for 1000 hours LM50

±0.08

°C

POWER SUPPLY

IDD

Operating current

TA = TMIN to TMAX

4.5V ≤ +VS ≤ 10V

LM50 (Legacy chip)

95

180

μA

LM50 (New chip)

52

90

PSR

Line regulation(5)

TA = TMIN to TMAX

4.5V ≤ +VS ≤ 10V

LM50

-1.2

1.2

mV/V

ΔIDD

Change of quiescent current

TA = TMIN to TMAX

4.5V ≤ +VS ≤ 10V

LM50 (Legacy chip)

2

μA

LM50 (New chip)

8

IDD_TEMP

Temperature coefficient of

quiescent current

TA = TMIN to TMAX

4.5V ≤ +VS ≤ 10V

LM50B

1

μA/°C

LM50C

2

(1)

Limits are specified to TI's AOQL (Average Outgoing Quality Level).

(2)

Accuracy is defined as the error between the output voltage and 10mv/°C multiplied by case temperature of the device plus 500mV, at

specified conditions of voltage, current, and temperature (expressed in °C).

(3)

Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated

temperature range of the device.

(4)

For best long-term stability, any precision circuit provides best results if the unit is aged at a warm temperature, and/or temperature

cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-

soldered; allow time for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The

drift after 1000 hours does not continue at the first 1000 hour rate.

(5)

Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating

effects can be computed by multiplying the internal dissipation by the thermal resistance.

LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

www.ti.com

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