6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Supply voltage, +VS

LM50 (LM50B and LM50C)

-0.2

12

V

LM50HV

-0.2

39.6

Output voltage, VO

LM50 (LM50B and LM50C)

-1 +VS + 0.6(2)

V

LM50HV

-0.3 +VS + 0.3(2)

Output current, IOUT

10

mA

Maximum junction temperature, TJ

150

°C

Storage temperature, Tstg

LM50 (LM50B and LM50C)

-65

150

°C

LM50HV

-65

175

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Maximum voltage must not exceed 12V for LM50 and 39.6V for LM50HV.

6.2 ESD Ratings

VALUE

UNIT

V(ESD),

Electrostatic

discharge

LM50 (LM50B and LM50C)

Human-body model (HBM), per JESD22-A114(1)

±2000

V

LM50HV

±2500

LM50 (LM50B and LM50C)

Charged-device model (CDM), per JEDEC specification JESD22-C101

±750

V

LM50HV

±1000

(1)

The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF

capacitor discharged directly into each pin.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

+VS

Supply voltage

LM50 (LM50B and LM50C)

4.5

10

V

LM50HV

3

36

TMIN,TMAX

Specified temperature

LM50B

Legacy chip

-25

100

°C

New chip

-40

125

LM50C

-40

125

LM50HV

-40

150

6.4 Thermal Information

THERMAL METRIC(1)

LM50

LM50HV

UNIT

DBZ (SOT-23) Legacy chip

DBZ (SOT-23) New chip

DBZ (SOT-23)

3 PINS

3 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

291.9

240.6

240.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

114.3

144.5

144.5

°C/W

RθJB

Junction-to-board thermal resistance

62.3

72.3

72.3

°C/W

ψJT

Junction-to-top characterization parameter

7.4

28.7

28.7

°C/W

ψJB

Junction-to-board characterization parameter

61

71.7

71.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

www.ti.com

LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

Copyright © 2025 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: LM50 LM50HV