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STM32L412C8I6TR Datasheet(PDF) 168 Page - STMicroelectronics

No. de pieza STM32L412C8I6TR
Descripción Electrónicos  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 128KB Flash, 40KB SRAM, analog, ext. SMPS
PDF  192 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L412C8I6TR Datasheet(HTML) 168 Page - STMicroelectronics

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Package information
STM32L412xx
168/192
DS12469 Rev 4
Figure 41. UFBGA64 – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid
array package recommended footprint
e
-
0.500
-
-
0.0197
-
F
0.700
0.750
0.800
0.0276
0.0295
0.0315
ddd
-
-
0.080
-
-
0.0031
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 95. UFBGA – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
Table 96. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.100 mm



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